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Standard Chip Component Dimensions
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Tom H View Drop Down
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    Posted: 30 Oct 2021 at 5:52pm
Then you never downloaded and installed our V2021 Footprint Expert program. 

All the information is available to you for free. 
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Dear Sirs,

I'm studying SMD Technology and do not understand what SOD-123 means. 

I know that this is a diode packaging specification (Small Outline Diode). But the number 123? 

I cannot find any documents on the internet about this package.  

I will appreciate your comments. 

Thanks in advance.
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Almost all the standard components have their standard component size included in all CAD softwares.
If you are not able to find the footprint of your component then you can make it yourself.
Simply observe the dimensions of your component and add it to the list and use it.
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Thanks for your sharing.
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Tom H View Drop Down
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Points: 6031 		Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 12 Jul 2015 at 7:30pm
That is the correct table for the 2010 version of IPC-7351B.
 
For your 0603, it falls in the large component type and the same solder joint rules apply in both the IPC-7351B and IPC-7351C.
 
Here is the updated table for IPC-7351C and this is in V2015.15 of Library Expert Pro, Lite and Viewer for the smaller chip sizes.
 
As you can see, 0402, 0201 and 01005 have different Toe goals to prevent tomb-stoning.
 
 
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Points: 71 		Post Options Post Options   Thanks (1) Thanks(1)   Quote drj-bbe Quote  Post ReplyReply Direct Link To This Post Posted: 12 Jul 2015 at 7:03pm
Thanks for your information.
 
There is a principles in IPC-7351B for 0603 component below. It seems different with the table you provided.  The current principles will be replaced by new technology, right?
 
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Tom H View Drop Down
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Points: 6031 		Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 10 Jul 2015 at 8:56am
This is new (unreleased) technology that we are testing this summer. It might be added to IPC-7351C but IPC wants it fully tested first.
 
I am a CIT trainer and teach hand soldering techniques to students.
 
The J-STD-001 has guidelines for minimum and maximum solder joint goal ranges. Every Terminal Lead form has it's specific percentages for pad size calculations. Example: Gull Wing lead is based on percentage of the pin pitch.
 
I'm just giving you a glimpse of the near future that you will not find in any publication today, will be in every standard next year.
 
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Points: 71 		Post Options Post Options   Thanks (1) Thanks(1)   Quote drj-bbe Quote  Post ReplyReply Direct Link To This Post Posted: 09 Jul 2015 at 8:40pm
Many thanks for your feedback on this.
 
In order to understand fully the table you provided, I tried to find the table in IPC-J-STD-001F, but not see it. For 2016 J-STD-001, is it new version?
 
I didn't find it in IPC website, only find F version.
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Tom H View Drop Down
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Here is the 2016 J-STD-001 SMD Proportional pad stack table for pad size calculations for Chip components. The Courtyard Excess has a 0.25 mm limiter on it, but all the percentages and values are user definable.
 
 
Good luck with finding a single footprint to successfully accommodate every 0603 package. The Height is the main driver of this component lead form.
 
Issue: if you use a 0603 land pattern considering the highest package, you may be dumping too much solder on an 0603 that is 50% of that height, introducing potential tomb-stoning.
 
This new Proportional SMD technology will be available in the V2016 Library Expert.
 
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Points: 71 		Post Options Post Options   Thanks (1) Thanks(1)   Quote drj-bbe Quote  Post ReplyReply Direct Link To This Post Posted: 09 Jul 2015 at 6:14pm
Sorry, I just want to use the same footprint for every 0603 Capacitor and Resistor regardless of their tolerance and package height.
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