Same chip size but different terminal metalization

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   Hi to all,
I have been making a small research with footprints on same resistor size.

I have been working with Samsung, Vishay and Yageo.

According with PCBLibraries here is the data of each component

As it was supposed the size of the pads are different because the metal termiantions are different. I took Samsung and Yageo in order to see any difference between them.

Taking the same center reference here is a comparison.

The top pads are obtained using PCBL with SAMSUNG data
Th ebottom pads are obtained using PCBL with YAGEO data
The green body is the YAGEO resistor.
The  magenta body is the SAMSUNG resistor

The Samsung part on the Yageo footprint is "at limit"
In the other hand, the Yageo part on the Samsung footprint has a big amount of ceramic over the pad.

My opinion is the the Samsung part is ok over the Yageo footprint. 

I would like to know your opinion about it. 
I know that it is impossible to have only a footprint for all  resistors, caps,....

Thanks a lot for your time.
Regards.
David

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dramos Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 18 Feb 2021 Status: Offline Points: 61	Post Options Post Reply Quote dramos Report Post Thanks(0) Quote Reply Topic: Same chip size but different terminal metalization Posted: 18 Feb 2021 at 2:19am
	Hi to all, I have been making a small research with footprints on same resistor size. I have been working with Samsung, Vishay and Yageo. According with PCBLibraries here is the data of each component As it was supposed the size of the pads are different because the metal termiantions are different. I took Samsung and Yageo in order to see any difference between them. Taking the same center reference here is a comparison. The top pads are obtained using PCBL with SAMSUNG data Th ebottom pads are obtained using PCBL with YAGEO data The green body is the YAGEO resistor. The magenta body is the SAMSUNG resistor The Samsung part on the Yageo footprint is "at limit" In the other hand, the Yageo part on the Samsung footprint has a big amount of ceramic over the pad. My opinion is the the Samsung part is ok over the Yageo footprint. I would like to know your opinion about it. I know that it is impossible to have only a footprint for all resistors, caps,.... Thanks a lot for your time. Regards. David



Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Online Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(1) Quote Reply Posted: 18 Feb 2021 at 8:59am
	As long as the Terminal Lead is on the pad it will work OK. For the Chip component family, the solder strength is under the Terminal Lead and the Toe area. The Heel only provides area for packages with different Terminal Lead Lengths. The assembly problems occur when the Terminal Lead falls off the pad.
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