Fixes & Enhancements:

• FP Designer:
• Creating a surface mount Bottom Side pad with solder mask, the Pad Stack Name did not include the solder mask
• When selecting a Bottom Side SMD pad that was placed, the program opened the wrong properties dialog box
• Fixed an issue with courtyard excess for Bottom Side SMD pad stacks
• Added a new feature for adding lead zero's for A01 - A09
• Updated the ODA Pad Stack Naming Convention Documentation
• Fixed an issue with pan and zoom. When adding pins, sometimes the program locked up
• Library Editor:
• New feature for adding New Rows and Copy/Paste an existing row into the new rows without the Part Number
• When all the cell data is the same except the part numbers are different
• Saving footprint rotation in FPX was removed. The footprint rotation now follows the Master Options.
• Cleaned up the user interface editing functions including Undo/Redo
• When updating a Row, the program didn't ask to update the Physical Description
• When columns were deleted and a new FPX file was imported with the same column header, the additional columns were not added
• Calculators:
• Surface Mount:
• LCC - 2-Sided version:
• The heel did not follow the solder joint goals in Options
• The pin 1 polarity dot was missing
• Through-hole: 
• SIP - Single-Inline-Package:
• No silkscreen trimming for offset pads
• Footprint Name wasn't getting the correct pin pitch 
• All component families can now move to FP Designer
• Options:
• Through-hole Rounded Square pad shape did not follow the Option settings when assigned to the 'Default Pad Shape'