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Intended Stencil Thickness per IPC Standards

Printed From: PCB Libraries Forum
Category: General
Forum Name: General Discussion
Forum Description: general topics not related to other forums
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3472
Printed Date: 22 Feb 2025 at 1:37pm


Topic: Intended Stencil Thickness per IPC Standards
Posted By: rweber
Subject: Intended Stencil Thickness per IPC Standards
Date Posted: 20 Feb 2025 at 11:28am
Using the IPC standards used by Footprint Expert, is there an intended stencil thickness being considered?

Stencil thickness is relevant since it is a factor in the volume of paste deposited, and the aperture area ratio/aspect ratio affecting paste release.

For example, I often see example stencil designs on Texas Instruments datasheets that are given for a 0.125mm stencil thickness.




Replies:
Posted By: Tom H
Date Posted: 20 Feb 2025 at 4:50pm
0.125 mm is a standard paste mask stencil thickness. 

But microminiature footprints might have the stencil thinned to 0.10 mm. 

IPC-7525C Stencil Design Guidelines is the leading document. 

Rounded Rectangle apertures help stencil release for lead-free solder alloys.




 


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