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Cylindrical End Cap Devices - Toe/Heel/Side Goals

Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Product Suggestions
Forum Description: request new features
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3297
Printed Date: 21 Nov 2024 at 5:26pm


Topic: Cylindrical End Cap Devices - Toe/Heel/Side Goals
Posted By: jde0503
Subject: Cylindrical End Cap Devices - Toe/Heel/Side Goals
Date Posted: 20 Jul 2023 at 9:40am
Devices with Cylindrical End Cap terminations should have different groups of toe/heel/side solder goals based on device height/length/width.

This has been done with rectangular end cap devices and should similarly be done for cylindrical.

There's no reason to have a part that is twice the size have the same toe/heel/side solder goals. This leads to wildly undersized or oversized pads.


Replies:
Posted By: Tom H
Date Posted: 22 Dec 2023 at 9:37am
We granted your wish and turned MELF solder joint goals into incremental pad stacks per the Nominal Diameter in V24.02 pre-release dated today 12/22/2023. 

New Nominal Diameter Ranges –

  • Dia. < 1.00
  • Dia. >= 1.00, < 2.00
  • Dia. >= 2.00, < 3.00
  • Dia. >= 3.00, < 4.00
  • Dia. > 4.00
Now you can control the Toe, Heel and Side for MELF Resistors, Diodes and Fuses. 

Thank you for recommending this feature. 

V24.02 will be officially released next week - http://www.pcblibraries.com/downloads" rel="nofollow - www.pcblibraries.com/downloads



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