http://www.pcblibraries.com/downloads" rel="nofollow - Updates & Bugs Fixed: - Console Options:
- IMPORTANT!: If you installed the V2022.01 pre-release you should manually delete ConsoleOptions.opt in this folder
C:\Program Files (x86)\PCB Libraries\Footprint Expert 2022 - When you open Footprint Expert it will auto-generate a new ConsoleOptions.opt that you can edit and save
- Redesigned the Decimal Place Accuracy Units interface
- Add new decimal place accuracy for Pad Size and Pad Place
- Options:
- Options > Drafting > Silkscreen Line Width:
- The Silkscreen Line Widths were not applying the assigned Density Level line width
- Options > Components > BGA
- If the “Add Fiducials if Pin Pitch” is any value other than 0.00, Batch Build auto-generates Fiducials outside the range specified
- FPX File Converter:
- 3-pin DFN component family was swapping the G & G1 dimensions
- 3D STEP:
- Radial Electrolytic Capacitor component family:
- Colorizing Pin 1 was reversed in the 3D STEP output
- SMD Aluminum Electrolytic Capacitor:
- Chamfered silkscreen outline was not matching the 3D STEP model chamfer
- CFP and CQFP component families
- Models were updated to remove the radius edges
- All Component Families:
- When changing a 3D model color to a Custom color, the color text name now indicates “Custom Color”
- Calculators:
- DPAK component family:
- Fixed an issue where you could not Hide or Delete pins after a pin rename
- Chip component family:
- Added a new silkscreen outline feature for small chips that could not produce a line without violating the Option rules
- CQFP component family with large pin pitch:
- Pin 1 polarity line was placing it on the right side of Pin 1
- Library Utilities:
- The Utilities > Update BOM From Library is the Cloud License version did not work
- CAD Interfaces:
- Xpedition:
- Added .asc file name when outputting ASCII version
- PADS Standard:
- Changed Version 10 to Version VX
- General:
- Added a Create and Close button to reduce mouse clicks
- Altium:
- Outputting 3D STEP added a Density Level Suffix in the .pas file to the 3D model name
- Updated the Bottom Side Assembly Outline in the translator to be optional
- Added a new feature that auto-deletes the PCBComponent_1 when creating a New Library
- Now saves then reopens a library when a new part is added to enable properties
- 3D STEP:
- Translator output was not allowing saving a .STEP file to a separate directory folder
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