Options > Pad Stack Rules > Diode Pin Names – fixed an issue for Numeric pin names.

Fixed an FP Designer Courtyard issue when translating older FPX files to V2021 format.

Fixed an FP Designer issue for Round footprints the diameter was coming in at 0.00 when translating old FPX files to V2021 format.

Drafting Symbols – when changing the line width value, then selecting “Apply or Done” the original 0.12 value came back.

Courtyard Excess – when changing the courtyard excess to 0.00 the courtyard hugs the pads and body, except Chip Components.Axial Lead component family – Correction made to Footprint Name.

BGA component family – Correction made to Footprint Name. V2021 was not pulling the body style from the FPX file plus 2021 BGA pins in D & E axis were swapped.

Molded Body component family – Correction made to Footprint Name. V2021 footprint name was missing optional L1 dimension.

Header, Right Angle component family – Correction made to Footprint Name. V2021 right-angle-header height was missing.

Header, Vertical component family – Correction made to Footprint Name.  R and S added to name prefix to denote receptacle or shrouded; height missing in vertical configuration; H replaced X before height.

2-pin Side Concave component family – Correction made to Footprint Name. V2021 doesn’t need pin count for 2 pin parts;  pitch removed as a factor in the side-concave name.

QFN Component Family – Correction made to Footprint Name.  Thermal Tab missing from pin quantity in parts with removed or hidden pins.

TO, Flange Mount component family – Correction made to Footprint Name. Replaced H with X before height.

SOIC component family – Correction made to Footprint Name, Physical Description and 3D STEP model.

Footprint Warning text redundancy fixed.