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Library Expert 2016.05 Released!!

Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Version History
Forum Description: software version release announcements & history
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=1890
Printed Date: 25 Nov 2024 at 1:45am


Topic: Library Expert 2016.05 Released!!
Posted By: Nick B
Subject: Library Expert 2016.05 Released!!
Date Posted: 18 May 2016 at 1:39pm
http://www.pcblibraries.com/downloads" rel="nofollow -
NEW / ENHANCED:
  • Preferences:
    • Added IPC-7351C footprint naming convention
      Library Expert now supports IPC-7351B and IPC-7351C Land Pattern Naming Conventions
    • Added back the Fabrication and Assembly Tolerances
      Note: It is highly recommended that you create a new Preference file
  • Calculator:
    • Through-hole Headers – updated the pin pattern option graphics
    • Updated the GUI markers for Required and Optional entries
    • Updated reference graphics for required and optional dimensions
    • Enlarged indicator light for Red, Green and Yellow status
    • Changed Transistor Outline (TO, DPAK) to DPAK
    • Changed SOTFL to SOFL and added the IC component family
    • Removed all A1 dimensions from Through-hole dimensional thumbnail images
    • Increased the Window Splitter line width
  • Altium:
    • Added freeform Keep-outs
  • PADS:
    • When two pins with same pin name are used, PADS will now properly use the generated FPX alphanumeric in its output
    • The default line width for associated copper was updated from 0.01 mm to 0.05 mm
  • General:
    • Increased the pad size of the internal pad that is generated for pads with associated copper
 
FIXED:
  • Altium:
    • Fixed an issue with poly shaped pads
  • Allegro/OrCAD PCB:
    • Fixed a problem that was causing Excess to not save as a preference
  • PADS:
    • Fixed an import issue when dealing with a .p and .d that had two different sets of alphanumeric pins
    • Fixed an import issue when there was no inner pad or drill, but an anti-pad and thermal were in the pad stack
  • 3D STEP:
    • Fixed a problem with the QFP that was causing a face to display improperly
    • Fixed an issue with SOIC that was causing it to display improperly in some viewers

 



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