I'm wondering if the implementation of the "New Solder Joint Goal Recommendations", from the "What is new in IPC-7351C" presentation, is in the newest Library Expert Lite or whether it is planned. I've tried adjusting the height of the package of a chip capacitor's "A" value, but it does nothing to change the pad size or Toe, Heel, or Side values.

Is there a way to do this in this version (2016.02) automatically? If not, is this in the pipeline or being currently worked in?

Thanks a bunch,

Thomas

The IPC 1-13 Land Pattern Committee postponed the introduction of the "Proportional SMD Pad Stacks" for at least 2 years. It will appear in the IPC-7351D release in 2018.

IPC-7351C is still in progress and has not gone through the ballot voting process yet.

Note: Library Expert V2016.03 will be released tomorrow Friday April 15.

I forgot to mention... Even though IPC has postponed SMD Proportional Pad Stacks, PCB Libraries, Inc. will release that technology in the V2017 release to allow the industry to test it out prior to adding it to the IPC standard.