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Densly packing tall components

Printed From: PCB Libraries Forum
Category: Libraries
Forum Name: Footprints / Land Patterns
Forum Description: [General or a CAD specific issues / discussions]
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=1266
Printed Date: 25 Nov 2024 at 9:28am


Topic: Densly packing tall components
Posted By: NeilVP
Subject: Densly packing tall components
Date Posted: 26 Feb 2014 at 3:57am
In my present commission I am required to mount 80+ CAPC6050x500 capacitors into a relatively small area. In experimenting with FP Expert I noticed that the courtyard does not vary with the height of the component and my concern is that placing a lot of tall components, courtyard to courtyard, may cause problems in reflow as there may be problems with shadowing in IR ovens and dead spots if using forced air convection.
My questions are - is my concern realistic and are there any further recommendations for this situation? 
 
Many thanks
 
Neil


Replies:
Posted By: Tom H
Date Posted: 26 Feb 2014 at 7:11am

The FP Designer is Strictly used for Mfr. Recommended Footprint patterns for Non-Standard component packages that do not fit into the IPC Calculator.

The user defines the placement courtyard size based on their personal requirements (because the component manufacturer's do not recommend any courtyard dimensional data).

 



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Posted By: Tom H
Date Posted: 26 Feb 2014 at 7:16am
I'm getting the FP Designer and the Library Expert Calculator mixed up here.

The IPC Calculator is just a recommendation (not a hard coded standard).

Placement Courtyard sizes for each 3-Tier Environment are -

  1. Least = 5 mil (0.12 mm)
  2. Nominal = 10 mil (0.25 mm)
  3. Most = 20 mil (0.50 mm)

The User can change the courtyard excess value to anything you want in User Preferences or on the fly in the IPC Calculator.




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