Can you have the case code for Footprint

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   Hi All,
I have created three ceramic chip capacitors which are 0805 package size. 

The components have almost identical footprints but have different heights. 

Can all these chip ceramic capacitors have the same case code (C0805)? What is the naming convention for all the chip capacitors of the same package size? 

I also downloaded a chip capacitor from parts on demand Mfr. P/N 08053D105KAT2A which has a case code of C0805. 

Here are the footprints of the parts I've created in my new footprint library:

The manufacturer is Kemet. The footprint names, physical and logical description are as follows: 
Footprint name 			Physical description 								
1. CAPC200X125X88L50 	Capacitor, Chip; 2.00 mm L X 1.25 mm W X 0.88 mm H body 
logical description 
Capacitor, Chip, Ceramic, General Purpose, 100nF, 50V, X&R, 0805

Footprint name 			Physical description 								
2. CAPC200X125X140L50 	Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.40 mm H body
logical description 
Capacitor, Chip, Ceramic, General Purpose, 220nF, 50V, X7R, 0805

Footprint name 			Physical description 								
3. CAPC200X125X100L50 	Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.00 mm H body
logical description 
Capacitor, Chip, Ceramic, General Purpose, 10nF, 50V, X7R, 0805

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almhuq75 Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 27 Apr 2016 Status: Offline Points: 9	Post Options Post Reply Quote almhuq75 Report Post Thanks(0) Quote Reply Topic: Can you have the case code for Footprint Posted: 18 Apr 2024 at 1:10pm
	Hi All, I have created three ceramic chip capacitors which are 0805 package size. The components have almost identical footprints but have different heights. Can all these chip ceramic capacitors have the same case code (C0805)? What is the naming convention for all the chip capacitors of the same package size? I also downloaded a chip capacitor from parts on demand Mfr. P/N 08053D105KAT2A which has a case code of C0805. Here are the footprints of the parts I've created in my new footprint library: The manufacturer is Kemet. The footprint names, physical and logical description are as follows: Footprint name Physical description 1. CAPC200X125X88L50 Capacitor, Chip; 2.00 mm L X 1.25 mm W X 0.88 mm H body logical description Capacitor, Chip, Ceramic, General Purpose, 100nF, 50V, X&R, 0805 Footprint name Physical description 2. CAPC200X125X140L50 Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.40 mm H body logical description Capacitor, Chip, Ceramic, General Purpose, 220nF, 50V, X7R, 0805 Footprint name Physical description 3. CAPC200X125X100L50 Capacitor, Chip; 2.00 mm L X 1.25 mm W X 1.00 mm H body logical description Capacitor, Chip, Ceramic, General Purpose, 10nF, 50V, X7R, 0805



Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Online Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 18 Apr 2024 at 3:29pm
	You have 3 different package heights. The Height does not affect the Footprint, it affects the 3D STEP model. i.e.: the same package dimensions and tolerances but different package heights will produce the same pad stacks. You could have one main entry for CAPC0805 Footprint Name and multiple rows that have "3D STEP Model" in the Part number. However, if you don't have a license for 3D STEP, create one entry in your FPX file. Or make all your Heights the same value to create the same Footprint Name. You can have many identical Footprint Names, but when you Batch Build Footprint Expert will only create the first entry and ignore all the duplicate names.
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almhuq75 Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 27 Apr 2016 Status: Offline Points: 9	Post Options Post Reply Quote almhuq75 Report Post Thanks(0) Quote Reply Posted: 19 Apr 2024 at 11:35am
	Hi Tom, I have a license of 3D STEP file. All the parts that I created for the chip capacitor have different part numbers. Could i create a case code such as C0805-88 for chip capacitor with height 0.88 mm and another chip capacitor with Case Code C0805-1.4 with a height of 1.40 mm. I am creating unique parts in my FPX library although some parts have the same case package. Once I batch generate the footprints in Altium I want to link all the footprints with the 3D step files to the schematic symbols that I have created in Altium. Once I generate the BOM, I can be sure that the footprints are tied the the parts and accurate. Will PCB FPX library have an issue creating new case code such as C0805-1.4 or should I just create one standard chip capacitor with CAPC0805 case code like you have suggested? -Al

Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Online Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 19 Apr 2024 at 1:11pm
	You can manually edit every Footprint Name to whatever you want. You can create as many FPX files as you want. You might want to keep all your Footprints in one FPX file and all your 3D STEP models in a separate FPX file. Name the FPX files so you know what they contain. Example: Chips.fpx and 3D STEP Models.fpx Use the Import 3D STEP feature in Altium. The 3D STEP rotation and origin are the same as the footprint.
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