Interstitial Ball Grid Array Package (IBGA) |
Post Reply |
Author | |
adamalport
New User Joined: 07 Jan 2013 Location: Scarborough, UK Status: Offline Points: 2 |
Post Options
Thanks(0)
Posted: 28 Jul 2022 at 3:34am |
I don't think Footprint Expert is able to create the Interstitial Ball Grid Array Package. This is where the balls are in a diagonal pattern rather than in simple in-line rows and columns.
I have just come across the package with an NXP Semiconductor i.MX 8DualXPlus device MIMX8DXnAVxFZAC, they call the package FCPBGA, With lid 21 x 21 x 2.37 PKG, 0.8mm Pitch, 609 I/O Interstitial SOT1916-1 |
|
Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718 |
Post Options
Thanks(0)
|
This NXP Case Code is on Parts on Demand - www.pcblibraries.com/POD ready for download - SOT1916-1
Footprint Expert can build any BGA in the electronics industry, especially in FP Designer. |
|
Post Reply | |
Tweet |
Forum Jump | Forum Permissions You cannot post new topics in this forum You cannot reply to topics in this forum You cannot delete your posts in this forum You cannot edit your posts in this forum You cannot create polls in this forum You cannot vote in polls in this forum |