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Footprints for low standoff flux removal

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ransonjd View Drop Down
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    Posted: 29 Sep 2020 at 7:51pm
Is there a simple setting to generate footprints for low standoff components with no solder mask under the body of the component? This is to increase the gap under the component for flux removal during cleaning. It's easy enough to edit the mask by hand for a few components, but it would be nice to automate. And I would prefer not to keep separate fpx files for no-clean and clean footprints for the same component.


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Tom H View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 30 Sep 2020 at 7:21am
You can use the "Drafting" feature to add solder mask removal shape (like a filled Rectangle). 

Place it at 0,0 or any coordinate. 

You know the "S" dimension (the space between pins) by selecting the Footprint tab. 

You know the length and width of the package from the component dimensions. 

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