Footprint Name Mfr. Extensions

You can edit the Footprint Name in the CAD Translator menu.

 

We suggested to IPC that the component mfr. abbreviation be added to the end of the Footprint Name and they initially agreed that it would be a good idea, but it has not been voted on by the IPC Land Pattern subcommittee.

 

So right now it's User Choice.

 

Instead, what I'm doing while waiting for the final verdict, I'm creating a FPX file for each component manufacturer. This way I avoid all package tolerance issues.

 

You will notice in the next release Maxim, National Semiconductor, Philips, Texas Instruments, Analog Devices and Freescale FPX files. The original content was provided by beta testers and volunteers and PCB Libraries, Inc. is verifing that all the dimensions and case codes are correct. So there will be major updates to these files every release. So please do not ever edit them because we're replacing them every release. If you want to use the data in these CM FPX files, Copy/Paste the line items into your personal FPX file.

 

 

 

 

We can't do anything until the IPC land pattern votes on this topic.

 

Then we'll be updating all of our FPX files (or maybe not if it's rejected).

 

 

However, if you still want the Mfr. Abbreviation document, contact me and I'll forward it to you.

 

The new naming convention recommendation is to add the thermal pad size at the end of the Footprint name.

 

Examples:

SOP65P600X120-14N_T300 = Thermal Pad is 3.00 mm Square