Footprint Expert 23.02 Released!!

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   Version 23.02 was just released!!

Fixes & Enhancements:
Resolved FIPS issue
Options:
Console Options was not restoring the component outline color if it was changed and restored
FP Designer:
Added a new feature – the silkscreen and assembly outlines now map to the outside of the package body outline
Assign Pins – Pin reorder was not working 100%
Physical Description Text File:
Updated the Physical Descriptions for all footprints with Thermal Pads
This impacted physical descriptions for footprints created in FP Designer 
Calculators:
Chip and MELF Assembly Ref Des was using the wrong package dimension to calculate the height
Resolved issues with Footprint Names:
DFN 2, 3, 4 – duplicating pin quantity
DPAK missing a tab dimension
SOJ & SOL, and OSCJ & OSCL & Crystal was using lead span E instead of body dimension of E1

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1908	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 23.02 Released!! Posted: 17 Jan 2023 at 9:15am
	Version 23.02 was just released!! Fixes & Enhancements: Resolved FIPS issue Options: Console Options was not restoring the component outline color if it was changed and restored FP Designer: Added a new feature – the silkscreen and assembly outlines now map to the outside of the package body outline Assign Pins – Pin reorder was not working 100% Physical Description Text File: Updated the Physical Descriptions for all footprints with Thermal Pads This impacted physical descriptions for footprints created in FP Designer Calculators: Chip and MELF Assembly Ref Des was using the wrong package dimension to calculate the height Resolved issues with Footprint Names: DFN 2, 3, 4 – duplicating pin quantity DPAK missing a tab dimension SOJ & SOL, and OSCJ & OSCL & Crystal was using lead span E instead of body dimension of E1
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