Footprint Expert 2021.09 Released!!

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2021.09 was just released!!

Updates & Bugs Fixed:
Drafting Options:
Added a new Right-Angle Triangle. This is mostly used for Pin 1 corner Polarity Marking. 
Console Options:
IPC-7351B Naming Convention – in the SOIC component family, the program was adding an extra X after the pin pitch.
Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error.
Pad Stack Rules – Gang Solder Mask Shape had a bug issue that affected solder mask shape on SMD pads.
Calculator Component Families:
All Grid Array’s (BGA, CGA & LGA) – setting the local Calculator solder mask in “Pad Stack Rules” panel does not work. A warning message was inserted prompting the user to set the solder mask swell in the “Terminal Density Level” panel.
All Through-hole Headers – When moving Headers to FP Designer and save to FPX, reopening the footprint dropped the Body Length & Width.
MELF:
When creating a Diode MELF, the local “Pad Stack Rules > Miscellaneous > Cathode/Anode Pin Names” was disabled.
When moving the MELF to FP Designer and save to FPX threw an error message.
Chip, MELF, Molded, SOD & SODFL Diodes - fixed Numeric/Alpha pin names and pin swap options on the right mouse button.
SMD Crystal – Physical Description had Body Length listed twice and no Body Width.
PQFN & PQFN w/Thermal – footprint name had wrong body length and width.
SOP w/Thermal – the Physical Description did not indicate w/Thermal Tab.
DIP and DIP Socket:
The Physical Description had the Length and Width swapped.
The Silkscreen Outline was not translating to any CAD tool.
When moving the DIP to FP Designer and save to FPX, reopening the footprint dropped the Body Width.
Flange Mount (TO) Horizontal – the Physical Description was missing the Body Length and the Pin Qty was incorrect.
Flange Mount (TO) Vertical – the Footprint Name and Physical Description had the Body Length and Width swapped.
All Through-hole families:
Pads and Holes on Assembly did not work properly.
Courtyard to Pad Excess was 0.45 and updated to 0.25.
CAD Tools:
KiCad – through-hole pad stacks had holes on assembly going to the fabrication layer.
Options:
Drafting > Silkscreen – changing the Reference Designator line width % was resetting back to 10% default when closing and reopening the program.

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1909	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 2021.09 Released!! Posted: 09 Jul 2021 at 12:29pm
	2021.09 was just released!! Updates & Bugs Fixed: Drafting Options: Added a new Right-Angle Triangle. This is mostly used for Pin 1 corner Polarity Marking. Console Options: IPC-7351B Naming Convention – in the SOIC component family, the program was adding an extra X after the pin pitch. Master FPX File Name – when the master FPX file name was longer than 20 characters, the program was throwing an Unhandled Exception Error. Pad Stack Rules – Gang Solder Mask Shape had a bug issue that affected solder mask shape on SMD pads. Calculator Component Families: All Grid Array’s (BGA, CGA & LGA) – setting the local Calculator solder mask in “Pad Stack Rules” panel does not work. A warning message was inserted prompting the user to set the solder mask swell in the “Terminal Density Level” panel. All Through-hole Headers – When moving Headers to FP Designer and save to FPX, reopening the footprint dropped the Body Length & Width. MELF: When creating a Diode MELF, the local “Pad Stack Rules > Miscellaneous > Cathode/Anode Pin Names” was disabled. When moving the MELF to FP Designer and save to FPX threw an error message. Chip, MELF, Molded, SOD & SODFL Diodes - fixed Numeric/Alpha pin names and pin swap options on the right mouse button. SMD Crystal – Physical Description had Body Length listed twice and no Body Width. PQFN & PQFN w/Thermal – footprint name had wrong body length and width. SOP w/Thermal – the Physical Description did not indicate w/Thermal Tab. DIP and DIP Socket: The Physical Description had the Length and Width swapped. The Silkscreen Outline was not translating to any CAD tool. When moving the DIP to FP Designer and save to FPX, reopening the footprint dropped the Body Width. Flange Mount (TO) Horizontal – the Physical Description was missing the Body Length and the Pin Qty was incorrect. Flange Mount (TO) Vertical – the Footprint Name and Physical Description had the Body Length and Width swapped. All Through-hole families: Pads and Holes on Assembly did not work properly. Courtyard to Pad Excess was 0.45 and updated to 0.25. CAD Tools: KiCad – through-hole pad stacks had holes on assembly going to the fabrication layer. Options: Drafting > Silkscreen – changing the Reference Designator line width % was resetting back to 10% default when closing and reopening the program.
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