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Do We Have a New Release of IPC-7351C?

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cgnd View Drop Down
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Post Options Post Options   Thanks (0) Thanks(0)   Quote cgnd Quote  Post ReplyReply Direct Link To This Post Posted: 30 Jul 2023 at 3:13pm
Is IPC-7352 intended as the replacement for IPC-7351B? Or is IPC-7352 intended to be used with IPC-7351B? As someone who is not involved with the development of these standards, it's a bit confusing trying to understand exactly what the differences between these two are.

The reason why I'm asking is because some other IPC standards use a "series" naming convention (e.g. IPC-6010 series with 6011, 6012, etc), where new revisions of each document use A, B, C, instead of changing the base document number.

However, in the case of IPC-7352, it seems like the revision naming went IPC-7351A -> IPC-7351B -> IPC-7352 for some reason. If IPC-7352 is intended to supersede IPC-7351B, does anybody know why they didn't just name it IPC-7351C for consistency?

Is there a description posted anywhere that details the changes/additions in IPC-7352 vs. the existing IPC-7351B doc? I haven't purchased IPC-7352 yet, and I'm trying to understand what the new standard includes that caused it to change the base document number instead of just going to rev C.
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Tom H View Drop Down
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Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 30 Jul 2023 at 5:05pm
The main reason why IPC-7352 replaced IPC-7351B is because 7352 includes Through-hole technology. 

IPC-7351 was 100% Surface Mount. 

The 7352 Naming Convention was expanded to include additional information like Thermal Pad size and other missing package data.

IPC-7352 is not a Standard. It's been downgraded to a guideline

The real "Standard" for solder joint goals is IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and it covers both Surface Mount and Through-hole technology.

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