PCB Libraries Forum : Questions & Answers

PCB Libraries Forum : Questions & Answers https://www.PCBLibraries.com/forum/ Fri, 24 Jul 2026 11:37:43 +0000 Thu, 23 Jul 2026 01:03:59 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 30 https://www.PCBLibraries.com/forum/RSS_topic_feed.asp?FID=34 <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Questions & Answers : Under-body outward L-lead courtyard calculation]]> https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14599.html#14599 Author: felecro
Subject: Under-body outward L-lead courtyard calculation
Posted: 23 Jul 2026 at 1:03am

Ok, thanks for the explanation.]]> Thu, 23 Jul 2026 01:03:59 +0000 https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14599.html#14599 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14598.html#14598 Author: Tom H
Subject: Molded Body D1 Dimension
Posted: 22 Jul 2026 at 12:15pm

The main issue with the Molded Body terminal lead flat against the package body is the 3D Model.

We'll add a new component family for the EIA 7343 series but the 3D STEP model will be an Extruded Block (no terminal leads).

This condition will take place when 'D1' is less than 0.60 mm than 'D'. The program will throw a warning.

It will be in the next V26.08 pre-release next week.

Thanks

]]> Wed, 22 Jul 2026 12:15:09 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14598.html#14598 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14597.html#14597 Author: Tom H
Subject: Molded Body D1 Dimension
Posted: 22 Jul 2026 at 8:40am

The Molded Body component family in the IPC-7351/7352 is intended for the JEDEC DO-241 (SMA, SMB & SMC) where the terminal lead is 0.20 mm thick and requires 0.60 mm difference between the 'D' and 'D1' dimensions.

The EIA 7343–31 has the terminal leads flat against the component package body.

Use FP Designer and the mfr. recommended pattern to create these footprints.

]]> Wed, 22 Jul 2026 08:40:05 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14597.html#14597 <![CDATA[Questions & Answers : Molded Body D1 Dimension]]> https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14596.html#14596 Author: AA310
Subject: Molded Body D1 Dimension
Posted: 22 Jul 2026 at 8:19am

Hello hello,

I am running the 26.07 version and the expected D1 reduction for a D case tantalum cap (EIA 7343–31) is 0.6 mm which I find ridiculous. I've measured most capacitors that we use in our designs (since the datasheets do not mention this parameter) and their D1 is at a minimum 7 mm.

Is there any way around this? I would like the footprints to be as accurate as possible. Thank you for your support!

]]> Wed, 22 Jul 2026 08:19:07 +0000 https://www.PCBLibraries.com/forum/molded-body-d1-dimension_topic2261_post14596.html#14596 <![CDATA[Questions & Answers : Under-body outward L-lead courtyard calculation]]> https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14595.html#14595 Author: Tom H
Subject: Under-body outward L-lead courtyard calculation
Posted: 21 Jul 2026 at 8:25am

All component packages taller than 10 mm get a larger courtyard excess per IPC-7351B Table 3-20. This is to make rework easier for failed components. You need to get extraction equipment (like heat nozzles) to unsolder the leads and remove the nonfunctional component and replace a new one.

However, if there are no plans on reworking failed packages, then change the courtyard excess to 0.20 or whatever value is your default setting in 'Tools > Options > Terminals > Under-body Outward L Lead > Courtyard'.

]]> Tue, 21 Jul 2026 08:25:48 +0000 https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14595.html#14595 <![CDATA[Questions & Answers : Under-body outward L-lead courtyard calculation]]> https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14594.html#14594 Author: felecro
Subject: Under-body outward L-lead courtyard calculation
Posted: 20 Jul 2026 at 11:19pm

Hello,

Yesterday I was approaced by one of our designers who has an issue with a new aluminium capacitor we added to the Altium component database. He wanted to use the new capacitor as a replacement for another that was added to the DB a few years ago. He expected them to be interchangable because they have same dimensions, but he encountered an issue with clearance between components.

As it turns out, the new capacitor has bigger courtyard and the reason for this is different courtyard calculation setting in the newever versions of FP Expert. From what I can see, the 2026 and 2025 version both have it under "Under-body Outward L Lead" settings. If the component height is greater than 10mm, the nominal density courtyard expansion is 0.4mm. If it's below 10mm, the standard 0.2mm is used.

I was wondering what was the motivation for this change and when did it happen? I tried search the forum for this topic but couldn't find anything about it.

]]> Mon, 20 Jul 2026 23:19:03 +0000 https://www.PCBLibraries.com/forum/underbody-outward-llead-courtyard-calculation_topic3663_post14594.html#14594 <![CDATA[Questions & Answers : BGAs, Density Levels, and Courtyard Changes]]> https://www.PCBLibraries.com/forum/bgas-density-levels-and-courtyard-changes_topic3661_post14590.html#14590 Author: mnperry
Subject: BGAs, Density Levels, and Courtyard Changes
Posted: 02 Jul 2026 at 8:42am

Thank you Tom!]]> Thu, 02 Jul 2026 08:42:35 +0000 https://www.PCBLibraries.com/forum/bgas-density-levels-and-courtyard-changes_topic3661_post14590.html#14590 <![CDATA[Questions & Answers : BGAs, Density Levels, and Courtyard Changes]]> https://www.PCBLibraries.com/forum/bgas-density-levels-and-courtyard-changes_topic3661_post14589.html#14589 Author: Tom H
Subject: BGAs, Density Levels, and Courtyard Changes
Posted: 02 Jul 2026 at 8:09am

BGA's are One Tier Density Level.

Setup the BGA rules in 'Tools > Options > Terminals > Collapsing BGA'

You define all the settings per Ball Diameter. You can also add additional ball diameters.

Ball Diameter
Pad Size Reduction (Adj. +/-)
Tolerance (Pad Var +)
Pad Size Rounding
Solder Mask +/-
Paste Mask +/-
Courtyard Excess +

]]> Thu, 02 Jul 2026 08:09:10 +0000 https://www.PCBLibraries.com/forum/bgas-density-levels-and-courtyard-changes_topic3661_post14589.html#14589 <![CDATA[Questions & Answers : BGAs, Density Levels, and Courtyard Changes]]> https://www.PCBLibraries.com/forum/bgas-density-levels-and-courtyard-changes_topic3661_post14588.html#14588 Author: mnperry
Subject: BGAs, Density Levels, and Courtyard Changes
Posted: 02 Jul 2026 at 7:48am

When I change density levels from "N" to "L" would I expect to see a change in Courtyard excess for BGA devices?

I see in Options\Terminals\SM Grid Array and BGA...that:

"Grid array settings are not subject to Density Level Rules.

]]> Thu, 02 Jul 2026 07:48:49 +0000 https://www.PCBLibraries.com/forum/bgas-density-levels-and-courtyard-changes_topic3661_post14588.html#14588 <![CDATA[Questions & Answers : Font settings]]> https://www.PCBLibraries.com/forum/font-settings_topic3659_post14585.html#14585 Author: Jeff.M
Subject: Font settings
Posted: 23 Jun 2026 at 9:13am

Could you explain how would such an option would work, bearing in mind that the footprint is already formed when it gets to the translator? Sounds like it might need a cross-reference table. If it gets too complex, we should pursue it off the forum.

Jeff

]]> Tue, 23 Jun 2026 09:13:51 +0000 https://www.PCBLibraries.com/forum/font-settings_topic3659_post14585.html#14585