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  <title>PCB Libraries Forum : Same chip size but different terminal metalization</title>
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  <pubDate>Fri, 15 May 2026 22:01:05 +0000</pubDate>
  <lastBuildDate>Thu, 18 Feb 2021 08:59:46 +0000</lastBuildDate>
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   <title><![CDATA[Same chip size but different terminal metalization : As long as the Terminal Lead is...]]></title>
   <link>https://www.PCBLibraries.com/forum/same-chip-size-but-different-terminal-metalization_topic2819_post11232.html#11232</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 2819<br /><strong>Posted:</strong> 18 Feb 2021 at 8:59am<br /><br />As long as the Terminal Lead is on the pad it will work OK.&nbsp;<div><br></div><div>For the Chip component family, the solder strength is under the Terminal Lead and the Toe area.&nbsp;</div><div><br></div><div>The Heel only provides area for packages with different Terminal Lead Lengths.&nbsp;</div><div><br></div><div>The assembly problems occur when the Terminal Lead falls off the pad.&nbsp;</div><div><br></div>]]>
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   <pubDate>Thu, 18 Feb 2021 08:59:46 +0000</pubDate>
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   <title><![CDATA[Same chip size but different terminal metalization : Hi to all,I have been making a...]]></title>
   <link>https://www.PCBLibraries.com/forum/same-chip-size-but-different-terminal-metalization_topic2819_post11231.html#11231</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=15739">dramos</a><br /><strong>Subject:</strong> 2819<br /><strong>Posted:</strong> 18 Feb 2021 at 2:19am<br /><br />Hi to all,<div><br></div><div>I have been making a small research with footprints on same resistor size.</div><div><br></div><div>I have been working with Samsung, Vishay and Yageo.</div><div><br></div><div>According with PCBLibraries here is the data of each component</div><div>&nbsp;</div><div><img src="uploads/15739/Captura1.PNG" height="159" width="761" border="0" /></div><div><br></div><div><br></div><div>As it was supposed the size of the pads are different because the metal termiantions are different. I took Samsung and Yageo in order to see any difference between them.</div><div><br></div><div><img src="uploads/15739/Captura2.PNG" height="139" width="446" border="0" /><br></div><div>Taking the same center reference here is a comparison.</div><div><br></div><div>The top pads are obtained using PCBL with SAMSUNG data</div><div>Th ebottom pads are obtained using PCBL with YAGEO data</div><div>The green body is the YAGEO resistor.</div><div>The&nbsp; magenta body is the SAMSUNG resistor</div><div><img src="uploads/15739/Captura3.PNG" height="678" width="608" border="0" /><br></div><div><br></div><div><br></div><div>The Samsung part on the Yageo footprint is "at limit"</div><div>In the other hand, the Yageo part on the Samsung footprint has a big amount of ceramic over the pad.</div><div><br></div><div>My opinion is the the Samsung part is ok over the Yageo footprint.&nbsp;</div><div><br></div><div>I would like to know your opinion about it.&nbsp;</div><div>I know that it is impossible to have only a footprint for all&nbsp; resistors, caps,....</div><div><br></div><div>Thanks a lot for your time.</div><div>Regards.</div><div>David</div><div><br></div><div><br></div><div><br></div>]]>
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   <pubDate>Thu, 18 Feb 2021 02:19:54 +0000</pubDate>
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