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  <title>PCB Libraries Forum : Solder paste for TH component</title>
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  <pubDate>Sun, 05 Apr 2026 07:23:09 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component : Hi Konrad,  Thanks for sharing...]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post718.html#718</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=19">Nightwish</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 04 Jun 2012 at 11:35pm<br /><br />Hi Konrad,<DIV>&nbsp;</DIV><DIV>Thanks for sharing this masterpiece of e-book on Pin in Hole Reflow.</DIV><DIV>&nbsp;</DIV><DIV>Thanks,</DIV><DIV>&nbsp;</DIV><DIV>Nightwish</DIV>]]>
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   <pubDate>Mon, 04 Jun 2012 23:35:13 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component :   Just came across this webpage....]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post693.html#693</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=64">konraditen</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 04 Jun 2012 at 7:25am<br /><br />Just came across this webpage. It is from the same guy.<br><br><a href="http://pihrtechnology.com/" target="_blank" rel="nofollow">http://pihrtechnology.com/</a> <br><br>Regards,<br><br>&nbsp;Konrad<br>]]>
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   <pubDate>Mon, 04 Jun 2012 07:25:37 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component : Hi konraditen,  You are right...]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post614.html#614</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=19">Nightwish</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 29 May 2012 at 11:41pm<br /><br />Hi konraditen,<DIV>&nbsp;</DIV><DIV>You are right and we want to use pin in paste for TH parts. Thanks for sharing that article.</DIV><DIV>&nbsp;</DIV><DIV>Regards,</DIV><DIV>&nbsp;</DIV><DIV>Nightwish</DIV>]]>
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   <pubDate>Tue, 29 May 2012 23:41:18 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component :  Are you talking about Pin In...]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post595.html#595</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=64">konraditen</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 29 May 2012 at 1:49pm<br /><br />Are you talking about Pin In Hole reflow process (PIHR)?<br>Here is a link from Bob Willis article.<br><br><a href="http://www.smtnet.com/bob-willis/pihirp.html" target="_blank" rel="nofollow">http://www.smtnet.com/bob-willis/pihirp.html</a> <br><br>]]>
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   <pubDate>Tue, 29 May 2012 13:49:15 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component : Hi Tom,  I agree with you and...]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post543.html#543</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=19">Nightwish</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 29 May 2012 at 1:06am<br /><br />Hi Tom,<DIV>&nbsp;</DIV><DIV>I agree with you and I also never heard of this but I was told by EE that they have products that go through reflow for all parts on board including TH components. The problem is how much the solder paste is needed in order to ensure enough solder fulfilled in hole to make a stable solder joint. I will let the EE to confirm with the factory guys on this issue. In IPC7525 there is a chapter talking about the mathematical formula to calculate this but seems a little complex.</DIV><DIV>&nbsp;</DIV><DIV>Thanks,</DIV><DIV>&nbsp;</DIV><DIV>Nightwish</DIV>]]>
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   <pubDate>Tue, 29 May 2012 01:06:24 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component :   I&amp;#039;ve never heard of this....]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post480.html#480</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 25 May 2012 at 12:29pm<br /><br />I've never heard of this. <div>&nbsp;</div><div>Through-hole parts must be manually hand soldered or wave solder. </div><div>&nbsp;</div>]]>
   </description>
   <pubDate>Fri, 25 May 2012 12:29:22 +0000</pubDate>
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   <title><![CDATA[Solder paste for TH component : All,  The EE want the through...]]></title>
   <link>https://www.PCBLibraries.com/forum/solder-paste-for-th-component_topic179_post464.html#464</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=19">Nightwish</a><br /><strong>Subject:</strong> 179<br /><strong>Posted:</strong> 24 May 2012 at 11:06pm<br /><br /><DIV>All,</DIV><DIV>&nbsp;</DIV><DIV>The EE want the through hole component to be attached onto board in reflow process but in this case how to create the solder paste? In our library we usually don't have the solder paste for TH parts because they are wave solderedor hand inserted. I know there is a way to calculate the paste apture in IPC guidelines but it seems a little complex, so I am wondering if there is a little tool kit or easier way to do this.</DIV><DIV>&nbsp;</DIV><DIV>Many thanks,</DIV><DIV>&nbsp;</DIV><DIV>Nightwish</DIV>]]>
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   <pubDate>Thu, 24 May 2012 23:06:26 +0000</pubDate>
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