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  <title>PCB Libraries Forum : Non-collapsing vs Collapsing BGA Balls</title>
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   <title><![CDATA[Non-collapsing vs Collapsing BGA Balls : Thanks a million Tom! ]]></title>
   <link>https://www.PCBLibraries.com/forum/noncollapsing-vs-collapsing-bga-balls_topic1708_post6978.html#6978</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=5302">tatets</a><br /><strong>Subject:</strong> 1708<br /><strong>Posted:</strong> 16 Jun 2015 at 7:09pm<br /><br />Thanks a million Tom!]]>
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   <pubDate>Tue, 16 Jun 2015 19:09:12 +0000</pubDate>
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   <title><![CDATA[Non-collapsing vs Collapsing BGA Balls :  Question is, should 0.30-0.75...]]></title>
   <link>https://www.PCBLibraries.com/forum/noncollapsing-vs-collapsing-bga-balls_topic1708_post6954.html#6954</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 1708<br /><strong>Posted:</strong> 11 Jun 2015 at 7:19am<br /><br /><em><font color="#0000ff"><strong>Question is, should 0.30-0.75 ball diameter still applicable for 0.500 pitch packages?</strong></font></em><div><span style="line-height: 16.79px;"><em><font color="#0000ff"><strong>Question is, should 0.15-0.25 ball diameter still applicable for 0.65 pitch packages?</strong></font></em></span></div><div><span style="line-height: 16.79px;">&nbsp;</span></div><div><span style="line-height: 16.79px;">Here is the Ball Size to Pin Pitch table from IPC-7351B: </span></div><div><span style="line-height: 16.79px;">&nbsp;</span></div><div><span style="line-height: 16.79px;"><img src="uploads/3/BGA_Pitch_VS_Ball_Size.png" height="261" width="680" border="0" /></span></div><div><span style="line-height: 16.79px;">&nbsp;</span></div>]]>
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   <pubDate>Thu, 11 Jun 2015 07:19:23 +0000</pubDate>
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   <title><![CDATA[Non-collapsing vs Collapsing BGA Balls : Hi,Looking at the tables below,...]]></title>
   <link>https://www.PCBLibraries.com/forum/noncollapsing-vs-collapsing-bga-balls_topic1708_post6952.html#6952</link>
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    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=5302">tatets</a><br /><strong>Subject:</strong> 1708<br /><strong>Posted:</strong> 10 Jun 2015 at 8:30pm<br /><br />Hi,<div><br></div><div>Looking at the tables below, for non-collapsing we use 0.25 (or less) nominal land diameter &nbsp;for 0.50mm pitch packages. Question is, should 0.30-0.75 ball diameter still applicable for 0.500 pitch packages? Will the land pads not cause any bridging due to space constraints?</div><div><br></div><div>Similary, for collapsing we use 0.30 (or higher) nominal land diameter for 0.65mm pitch packages.&nbsp;<span style="line-height: 16.79px;">Question is, should 0.15-0.25 ball diameter still applicable for 0.65 pitch packages? Will the land pads not cause any reliability issues due to smaller pads?</span></div><div><span style="line-height: 16.79px;"><br></span></div><div><span style="line-height: 16.79px;">Thanks in advance for your help.</span></div><div><span style="line-height: 16.79px;"><br></span></div><div><span style="line-height: 16.79px;">Collapsing Ball</span></div><div><img src="uploads/5302/table-1-land-approximati&#111;n-mm-for-collapsible-solder-balls.png" height="358" width="355" border="0" /><br></div><div>Non-collapsing</div><div><img src="uploads/5302/table-2-n&#111;n-collapsing-bga-ball-land-calculati&#111;ns.png" height="339" width="264" border="0" alt="N&#111;n-collapsing" title="N&#111;n-collapsing" /><br></div><div><span style="line-height: 16.79px;"><br></span></div>]]>
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   <pubDate>Wed, 10 Jun 2015 20:30:16 +0000</pubDate>
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