Footprint Expert 2021.08 Released!!

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2021.08 was just released!!

Updates & Bugs Fixed:
Added the ability to edit the pad stack names in all Calculator created footprints.
Added a new feature for converting Excel spreadsheets into FPX files.
CAD Tools:
Allegro/OrCAD PCB – fixed an issue with the “Pad on Assembly” outline was going to the Silkscreen Layer.
Calculator Component Families:
Grid Array’s (BGA, LGA, CGA, PGA) – fixed an issue with rectangular shape packages.
TO Flange Mount Horizontal – the “d” dimension did not allow a value of 0.00.
Header, Right Angle – fixed an issue with the Pin Pattern option.
BGA – fixed an issue with Non-collapsing ball saved to FPX and reopened as Collapsing.
Several 2-Pin Component Families – when the component tolerance is 0.00 and the Map Outline to Body > Nominal the outline would flatline.
All – Pad on Assembly was disabled.
LCC – under certain conditions with dimensions and tolerances, pin 1 would inadvertently relocate from the Left Center to the Lower Left.
4-Pin DFN – when using the mfr. recommended pattern, pins 3 & 4 did not follow the mfr. dimensional values.
Header, Right Angle Post and Shrouded – the footprint name had 0 for package height and the Physical Description had 0.00 for Height.
FP Designer:
Pad Stack Manager – updated the feature for renaming pad stacks to include spaces in the name.
Footprint Name – selecting Case Code or Part Number did not register as a change.
Options:
There were updates and the only way to fix them is to recreate your Option file.

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1904	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 2021.08 Released!! Posted: 14 Jun 2021 at 5:39pm
	2021.08 was just released!! Updates & Bugs Fixed: Added the ability to edit the pad stack names in all Calculator created footprints. Added a new feature for converting Excel spreadsheets into FPX files. CAD Tools: Allegro/OrCAD PCB – fixed an issue with the “Pad on Assembly” outline was going to the Silkscreen Layer. Calculator Component Families: Grid Array’s (BGA, LGA, CGA, PGA) – fixed an issue with rectangular shape packages. TO Flange Mount Horizontal – the “d” dimension did not allow a value of 0.00. Header, Right Angle – fixed an issue with the Pin Pattern option. BGA – fixed an issue with Non-collapsing ball saved to FPX and reopened as Collapsing. Several 2-Pin Component Families – when the component tolerance is 0.00 and the Map Outline to Body > Nominal the outline would flatline. All – Pad on Assembly was disabled. LCC – under certain conditions with dimensions and tolerances, pin 1 would inadvertently relocate from the Left Center to the Lower Left. 4-Pin DFN – when using the mfr. recommended pattern, pins 3 & 4 did not follow the mfr. dimensional values. Header, Right Angle Post and Shrouded – the footprint name had 0 for package height and the Physical Description had 0.00 for Height. FP Designer: Pad Stack Manager – updated the feature for renaming pad stacks to include spaces in the name. Footprint Name – selecting Case Code or Part Number did not register as a change. Options: There were updates and the only way to fix them is to recreate your Option file.
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