Standard Chip Package Case Codes & Dimensions

Chip Resistor: 

Chip Non-polarized Capacitor:

Chip Inductor:

Chip Diode:

Chip LED:

Chip Antenna: 

Chip Polarized Capacitor:

If the Chip dimensions do not match the table then a new or different Case Code must be assigned. 

Note: there are various Heights to all of these packages, but the Height does not impact the resulting pad size for the Footprint Land Pattern. 

However, the Height is important for the 3D STEP model creation and should be included in the Footprint name. 

Also, the Terminal Lead may be a different length and that should be included in the Footprint Name because that does affect the resulting pad size. 

Here is a typical Footprint Name for a 0201 (0603 Metric) Capacitor part:

Footprint Land Pattern Name: CAPC60X32X27L15 

CAP = Capacitor

C = Chip

60 = 0.60 mm body Length

32 = 0.325 mm body Width

27 = 0.275 mm maximum Height

L15 = 0.15 mm nominal Lead Length

Notice that the Leading Zeros are ignored and only the first 2 numbers to the right of the decimal point is used in the Footprint Name. 

But the Leading zeros are in the Case Code. The Case Code = one number to the left and right of the decimal point. 

A typical Physical Description for this package will be: 

Capacitor, Chip; 0.60 mm L X 0.325 mm W X 0.275 mm H body

The EIA Inch Based Names are still widely used today in the electronics industry, even though the Metric Names created by EIAJ in Japan were first introduced in the 1980's in the PDP-100 publication. American assembly shops, EE engineers and component manufacturer's did not adapt to the metric naming convention and translated all of the original documentation from Metric to Imperial units so they could better comprehend the package sizes. This was one of the biggest mistakes in the global electronics industry and very short sited of the future of the industry. 

Today, all Standard package dimensions are printed using Metric Dimensions but the translated Inch Based package names have deep roots in the industry and have settled as the defacto standard. Now we have to deal with 2 systems of measurement rather than the supreme metric unit measuring system. 

Some manufacturers use a periphery solder joint goal and other use a Toe, Heel and Side pad stack. 

This is a new Terminal Lead form that has not been fully tested by the world standards like IPC-J-STD-001 for solder joint acceptability. 

Then we can post the Proteus footprint. 

Are you using the Free V2021 Footprint Expert Pro for Proteus? You could create the footprint in a couple minutes. 

To get 3 or more passive packages to fit into the same Footprint, find parts with the same dimensions and tolerances. If the package dimensions are the same but the tolerances are different, then round the tolerances off so that they are all the same. 

Change this setting in "Tools > Options > Pad Stack Rules > SMD Corner Rounding > Corner Radius Limit".