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Standard Chip Component Dimensions

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Tom H View Drop Down
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Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 09 Jul 2015 at 9:03am
Let's figure out what you really want. Do you want to use the same footprint for every 0603 Chip component in the electronics industry regardless of their tolerance and package height?
 
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Post Options Post Options   Thanks (1) Thanks(1)   Quote drj-bbe Quote  Post ReplyReply Direct Link To This Post Posted: 08 Jul 2015 at 7:38pm
Thanks for your reply.
Yes, Height and Tolerances can afftect land pattern size, and it is unique for every manufacturer.
But I cannot make unique land pattern for every manufacturer for an ex. 0603 component. I peffer to use only one land pattern for all brand 0603 components, not make many land patterns for a standard chip part in our library.
Could you please give your advice on this?
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Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 08 Jul 2015 at 7:50am
There are no EIA, JEDEC or IPC standards on chip size dimensions.
 
Here is the closest you will get to the Standard Case Sizes but good luck trying to find a manufacturer that uses these dimensions. Notice that the Height and Tolerances are missing because that is unique for every manufacturer. And the Height plays into the Toe solder joint calculation and the tolerances affect every aspect of the Land Pattern (footprint).
 
 
Download the document "Surface Mount Components" here - www.pcblibraries.com/downloads
 
It illustrates all the various types of SMD packages and the variety of Chip components.
 
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Post Options Post Options   Thanks (1) Thanks(1)   Quote drj-bbe Quote  Post ReplyReply Direct Link To This Post Posted: 08 Jul 2015 at 3:28am
Hello,
 
I am trying to find a standard land pattern for chip resistor or capacitor, ex. 0402, 0603, etc.
 
But one chip component may have different tolerance between each manufacturer, and land pattern calculated by Library Expert Pro will be different if according to component datasheet. If like this then I cannot get uniform land pattern design for one type component on board.
 
Is there a Industrial Standard for components package dimension? or some suggestions to make standard land pattern for one type component?
 
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