IPC Standards for Manufacturing & Assembly
Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Questions & Answers
Forum Description: issues and technical support
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=877
Printed Date: 19 Nov 2024 at 2:20am
Topic: IPC Standards for Manufacturing & Assembly
Posted By: sgdavies
Subject: IPC Standards for Manufacturing & Assembly
Date Posted: 08 Mar 2013 at 3:31am
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IPC Standards for Manufacturing & Assembly
I noticed that different companies specify and quote different IPC standards when sending their PCB's to Manufacture and Assembly, so I would like to get a feel which are the most commonly specified IPC standards on here? Any and all thoughts are welcome! I will start this, Currently we only specify the following:- IPC-A-600 - Acceptability of Printed Boards IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 - Specification for Base Materials for High Speed / High Frequency Applications IPC-4104 - Specification for Base Materials for High Density Interconnect (HDI) and Microvia Materials IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG) Plating for Printed Ciruit Boards IPC-4553 - Specification for Immersion Silver Plating for Printed Ciruit Boards IPC-4554 - Specification for Immersion Silver Tin for Printed Ciruit Boards IPC-4562 - Metal Foil for Printed Wiring Applications IPC-6011 - Quality and Performance Specification for Riged Printed Boards IPC-6013 - Quality and Performance Specification for Flexible Printed Boards IPC-6016 - Quality and Performance Specification for High Density Interconnect (HDI) Layers or Boards IPC-SM-840 - Qualification and Performance of Permanent Polmer Coating (Solder Mask) for Printed Boards |
Replies:
Posted By: Tom H
Date Posted: 08 Mar 2013 at 8:15am
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I have always used the IPC-A-600 - Acceptability of Printed Boards on every fabrication drawing (in the fab notes, Note 1). But I never have used an IPC reference on my assembly drawings except IPC J-STD-001D - Requirements for Soldered Electrical and Electronic Assemblies. |
Posted By: rdl86626
Date Posted: 08 Mar 2013 at 8:35am
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Hi,
We use IPC-A-600, IPC-4101, IPC- 6011, IPC-6012, IPC-6013, IPC-SM-840 FOR FABS
Assembly's only IPCF-STD-001 & QCI-080
Hope this helps-we do lots of military stuff.
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Posted By: Tom H
Date Posted: 11 Mar 2013 at 6:57pm
| Here is a good example of a set of fabrication notes for Lead Free (RoHS) and Class 3 and all the IPC standards that are referenced - uploads/3/Fabrication_Notes_Class_3.zip" rel="nofollow - Fabrication_Notes_Class_3.zip |
Posted By: lozlloyd
Date Posted: 08 Apr 2016 at 6:02am
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Hi Tom, Do you also have a set of PCB Assembly drawing notes available please?
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Posted By: Tom H
Date Posted: 08 Apr 2016 at 6:53am
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Here is a master set of PCB Assembly Notes in M/S Word. You'll need to customize them for your process. uploads/3/PCB_Assembly_Notes.zip" rel="nofollow - PCB_Assembly_Notes.zip ------------- Stay connected - follow us! https://twitter.com/PCBLibraries" rel="nofollow - X - http://www.linkedin.com/company/pcb-libraries-inc-/" rel="nofollow - LinkedIn |
Posted By: JamesUS
Date Posted: 06 Jul 2017 at 1:21am
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One of the important roles that IPC standards play in PCB manufacturer's is to help designer's and manufacturer's to negotiate the trade-off's between design effort and product performance. IPC’s work, with the goal of training and certifying manufacturing professionals to provide standardized workmanship, processes, and quality in a traceable fashion. Standard Spec Boards (PCB's) are inspected to IPC Class 2 Standards and Custom Spec Boards are inspected to either IPC Class 2 or Class 3 depending on the option to be chosen.
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