Watching a new video from Altium Academy,

https://www.youtube.com/watch?v=Qhe8BgAFokc&t=44s" rel="nofollow - https://www.youtube.com/watch?v=Qhe8BgAFokc&t=44s

I realized that they mention on one of their slides the IPC-7351C. 

Is there any news about it?

Thanks a lot for your comments.

Regards,

daraga

Then the IPC Land Pattern Committee paused for a year to focus on Through-hole guidelines for a new document called IPC-7352 and get that released ASAP. 

Then the IPC Land Pattern Committee decided to combine Through-hole and Surface Mount in the new IPC-7352 and scrap the IPC-7351C. 

Every reference to IPC-7351C must be deleted or scrubbed from the electronics industry. 

IPC-7352 should be released at the end of the year. It just went to ballot vote last month. 

Many thanks for the info. 

I hope to be able to read the new spec next winter.

Best regards,

dramos

Any news about IPC-7352 ?

Santa is coming.... 

Regards

David

It should be released by the end of the year and ready for the IPC Store at IPC APEX in San Diego the first week of February 2023. 

Presuming IPC-7352 would change a lot of calculations for pads etc. Do you have a timeline for supporting it?

Regards,

Ken

Select "Tools > Options > Open > IPC-7352" 

It turns off the fabrication and Assembly tolerances and updates all negative solder joint goals to 0.00. 

This will affect you pad stack calculations by +/- 0.05 in the length and width. 

There is also a IPC-7352 land pattern naming convention that we will support as a new Console Option. 

The new naming convention is going to differ from the PCB Libraries naming convention that was defined in Console Options till now?

From which version is going to available in Footprint Expert?

Regards,

david

We put the IPC-7351C in Library Expert V2017. We created Power Point presentations of all the changes and updates coming in IPC-7351C. 

Then 2 years ago Karen McConnell retired from the 1-13 committee chairperson and Gary Ferrari stepped down as Vice Chairman. 

IPC elected a new Chairman to take over and the decision was made to scrap 6 years of effort into IPC-7351C revert back to IPC-7351B and simply enhance it by adding Through-hole technology. 

The IPC-7351B naming convention was kept in tact but the committee added a couple features to improve it. 

One of the basic differences between IPC-7351C and IPC-7352 Naming Convention is the Pin Quantity. 

IPC-7351C relocated the Pin Quantity to the front of the Footprint Name. 

IPC-7351B had the Pin Quantity at the end of the Footprint Name. 

Footprint Expert V23 will support three Footprint Naming Conventions. 

Many thanks for the info. 

A part of the modification of the value of the Fabrication and Assembly tolerances, is there other modification on the pad's calculation formula?

If the main modification is this I consider that it is a minor change because you wrote many times that these values could be changed to 0.00 due to the accuracy of the new machines.

I can't wait the Footprint Expert V23 to check the changes.

Regards,

David

Tom H wrote: The IPC-7352.opt file is already on your computer.

Where can I find the IPC-7352 option file?

My installation folder appears to only contain an IPC-7351C.opt file (FPE Enterprise 2022.14).

Tom in his last response speaks about V23...

I think that we must wait until the new version is ready.

Regards,

dramos

C:\Program Files (x86)\PCB Libraries\Footprint Expert 2022

Which version of Footprint Expert are you using?

I have just installed 2022.14,11/8/2022 and I am not able to find that file.

Regards,

david

Could be some security software is interfering with the installation, maybe?

Not counting the folders, you should have about 20 files in this folder, you have far less than that.

Note: V2022.15 will be officially released this weekend. It will be the last release this year. 

In this thread, I see that the .opt for IPC-7352 should be there when installed, but I don't see it show up after installation.

Thank you.

Hi,

@tgrodnicki, I installed the Footprint Expert 2022 Enterprise Edition (2022.15,12/2/2022). There was the 7352.opt file.  I hope it will help you.

@Tom, I checked the 7352.opt and as you mentioned the fabrication and assembly tolerances are 0.00. Now we cannot find a negative value on the solder joint tables.

But what about the naming convention? Is there any change? Does the new standard continue with the same naming convention that was used on 7351-B?

Waiting to have the possibility to read the new standard.

Best regards,

David

That was fixed and all versions now have that Option file. Footprint Expert will still follow the IPC-7351 mathematical model until if and when the industry accepts IPC-7352, which may take a year or so. But at least we have a workaround in the meantime. 

It's important to note that when you open the IPC-7352.opt file to immediately save as another name because the Enterprise will overwrite the IPC-7352.opt file with every update. 

V23.01 will be released the first week of January 2023 and it will support the new IPC-7352 Footprint Naming Convention in the Console Options. 

Firstly, Happy New Year! All the best for the new 2023.

Regards,

David

The biggest difference between PCB Libraries and IPC-7352 is the location of the Pin Qty. 

PCB Libraries (IPC-7351C) the pin qty is in the beginning of the footprint name after the component family. 

IPC-7352 the pin qty is at the end of the footprint name (just like IPC-7351B). 

The IPC-7351B Pin 1 orientation in the Upper Left was a last minute change that should have never been adopted. 

IEC did not agree with the 2005 release Zero Component Orientation introduced in IPC-7351 so in 2007 IEC released IEC 61188-7 to correct the Zero Component Orientation back to what is was in IPC-SM-782. 

The IPC 1-13 Land Pattern committee never got a chance to vote on or approve the new Zero Component Orientation in IPC-7351. It was just slipped in at the last minute. 

This was a huge mistake by the 1-13 Land Pattern Committee chairman to approve this change. 

All rectangular component packages should be rotated to make the long direction "Horizontal" for many reasons. Your computer screen is long in Horizontal. Paper sizes are long in Horizontal. Most PCB designs are long in horizontal. This was never discussed in the final meeting where all the rectangular footprints were changed to the length in the Vertical direction. 

Many thanks for your replies. 

Starting from the end. It has a lot of sense to work with a footprint in a "horizontal" way instead of "vertical" way. Perhaps in a new revision of the standard (in the next 15 years) it will be taken into account.

About the naming convention, I found another difference  comparing two footprints, the lead size is not defined.

IPC-7352 : QFN50P500X400X80-28N

PCB Libraries: QFN28P50_500X400X80L40X25N

I think that it could be useful in some cases. It gives more info about how it is the component. 

The final pad length depends of the component's lead size.

Regards,

David

People ask me which Land Pattern Naming Convention is the best? 

I say PCB Libraries naming convention. We thought of everything to remove duplication of footprint names. 

All IPC documents for PCB design have been downgraded from "Standards" to "Guidelines". 

About 50% of all PCB designers don't use IPC documents for PCB design. The other 50% use IPC documents as a guideline but eventually develop their own standards. 

IPC is slowly pulling away from PCB design and focusing on Assembly and Fabrication. IPC J-STD-001 is the leading standard for Assembly Acceptability. All footprints should be IPC J-STD-001 compliant. 

IPC pulled the CID and CID+ training courses. They do have courses on Fabrication and Assembly. 

Select any of the buttons and you will not find any PCB design certification. 

$170

Thanks for the info. 

I checked it several times... they needed a lot of time to repare the printer, more than six months hahahaha.

Regards,

David

The reason why I'm asking is because some other IPC standards use a "series" naming convention (e.g. IPC-6010 series with 6011, 6012, etc), where new revisions of each document use A, B, C, instead of changing the base document number.

However, in the case of IPC-7352, it seems like the revision naming went IPC-7351A -> IPC-7351B -> IPC-7352 for some reason. If IPC-7352 is intended to supersede IPC-7351B, does anybody know why they didn't just name it IPC-7351C for consistency?

IPC-7351 was 100% Surface Mount. 

The 7352 Naming Convention was expanded to include additional information like Thermal Pad size and other missing package data.

IPC-7352 is not a Standard. It's been downgraded to a guideline. 

The real "Standard" for solder joint goals is IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and it covers both Surface Mount and Through-hole technology.