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• Library Editor:
• Updated the 3D Model Name column to add the file extension .STEP
• User Options > Drafting:
• Changed the term “Legend” to “Silkscreen”.
• Console Options:
• Updated the Layer order assignments.
• FP Designer:
• Fixed an issue with translating older FPX files that had “None” for the Body Outline.
• Cleaned up some UI text in the Pad Stack Designer.
• Library Editor:
• Batch Build did not work on multiple parts.
• Updated some TH component family Physical Descriptions to make them consistent with SM. DIP, SIP, OSC, DIPS were updated.
• Calculators:
• PSON – The mfr. Recommended pattern had a G1 dimension that was not intended. Removed.
• PSON – The Silkscreen Legend was not translating to CAD tools.
• Vertical Header – Assembly polarity marker did not move with relocating Pin 1.
• Vertical Header – Manually inserting package dimensions turned off the Pin Pattern feature.
• TO-220 Horizontal – Batch Build does not import 3D STEP.
• Axial Lead – The Silkscreen Legend was not translating to CAD tools.
• SMD Crystal – The Silkscreen Legend on the lower part was not displaying.
• Chip Array Side Concave – The Silkscreen Legend was not translating to CAD tools.