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NEW / ENHANCED:
- Added new user definable Top and Bottom Placement Keep-out Layers to the Interface menu
FIXED: - Calculator:
- Molded Body component family – Add D1 dimension
- Chip Array component families – Add Ferrite Bead
- Side Concave 2/4-pin component family – Add Capacitor
- Fixed a silkscreen Legend mapping to body issue in Chips, Molded Body, SOD & SODFL
- Updated the graphic thumbnail image for QFP with Thermal Pad was missing the A1 dimension
- Preferences:
- Updated Through-hole Pad Size round-off to equal the Hole Size round-off
- Fixed an issue where changing Preference files required closing and reopening the program before activating the new Preference file
- Fixed an issue in the DFN component family for Diode and LED alphanumeric pin names
- FP Designer:
- Fixed the Rounded Rectangle % to consider the smallest pad dimension instead of relying on the Y dimension only
- Fixed an issue in the Pad Stack Designer for chamfered SMD pads with solder mask swell; the chamfer on the solder mask was not 100% accurate
- Fixed an issue when moving parts from the Calculator that had mfr. recommended patterns to FP Designer, the program created 2 pad stacks the same size
- Altium:
- Fixed an error that was suppressing Bottom-side PTH Placement Keep-outs that were attached to pins
- Allegro / OrCAD PCB:
- Lines have now been added to the batch file to delete pre-existing .PAD or .DRA files; this should allow for regeneration without manual deletion
- Fixed an issue where irregular chamfered pads were inverting their corners
- Xpedition:
- Fixed an issue with PTH Thermal Relief patterns not coming through translator
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