Hi,

As an exercise, I did a batch build on the ALL of the parts in the "Sample Data - Standard Parts.fpx" file. I did it three times, selecting N, M, and L, also sequentially changing the suffix each time. I expected three different libraries, each with component names ending in either "N", "M", or "L".  This is not what I saw.  Some component's suffix were as expected, but all three files had "N" suffix components which was unexpected.  The "M" file had some "M"s, the "L" file had some "L"s, but some parts like a PARTTYPE CAPC1005X56 had ONLY the "N" suffix in all three files.  I did the test again, only selecting this single capacitor, and this time, the three libraries were as expected!  I am running Version 2013.17 with an "Evaluation License".  Any ideas?

Thanks,

Richard Chaney

BGA's have an automatic 3-Tier system and it's dependent on the Ball Size. 3-Tier BGA's do not create 3 different pad sizes. Only the Silkscreen Line Width, Ref Des Height, Local Fiducial Size and Courtyard Excess are auto-defined per the Ball Size. So even if you're trying to create a Most environment for BGA's you can't.

All Grid Array component families such as CGA, LGA, BGA fall into this category where the pad size is identical for Least, Nominal and Most environments.

Also, 4 of the parts in the "Sample" FPX were created using Footprint Designer and they were created using the component manufacturer recommended footprint pattern. So all FP Designer parts do not have a 3-Teir environment letter in the footprint name.

Hope this helps.