PCB Marking

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I need help determining what's the component on my computer PCB marked with M, it is surface mounted similar to a capacitor or an inductor.   Measured it with no resistance and has 0.12 uF.

Thanks

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mlh_biomed Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 24 Oct 2012 Status: Offline Points: 2	Post Options Post Reply Quote mlh_biomed Report Post Thanks(0) Quote Reply Topic: PCB Marking Posted: 24 Oct 2012 at 9:29am
	I need help determining what's the component on my computer PCB marked with M, it is surface mounted similar to a capacitor or an inductor. Measured it with no resistance and has 0.12 uF. Thanks



Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5717	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 25 Oct 2012 at 8:30am
	Is the "M" the last character in the Footprint Name? If so, it was built using the IPC-7351 "Most" Environment. n IPC-7351 Density Level A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices. The geometry furnished for these devices, as well as inward and “J” - formed lead contact device families, may provide a wider process window for reflow solder processes as well. n IPC-7351 Density Level B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded Gull Wing type devices. n IPC-7351 Density Level C: Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Note: IPC and IEC are both considering dropping the "Most" Envirnoment in the near future. It will still be available for PC boards that require hand-soldering. It has been proven that the "Nominal" Environment passes all the stress tests that the "Most" Environment does. So there is no longer a future need for the "Most" Environment. The "Least" environment will become the new Standard Footprint pattern coming up in the near future.