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Is it OK if pads go under an MSOP body?

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    Posted: 17 Oct 2022 at 6:13pm
I'm working on a footprint for a part that uses an MSOP-8 package. Is it normal for the pads to go underneath the body?

The package size is 2.8 mm to 3.2 mm, and the inner edges of the pads have 2.8 mm between them. This means that on a typical package size (3.0 mm) or especially the max (3.2 mm) the pads will extend under the body.

I looked at a couple manufacturer recommended land patterns and this seems to be the case on most of them. Does anyone know why this is the case, and is this an optimal land pattern design?
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 18 Oct 2022 at 12:10pm
The SOP/SOIC pads under the Gull Wing lead plastic body is typical if the minimum "A1" dimension is greater than 0.03 mm. 

If the "A1" dimension is less than 0.03 mm then Footprint Expert will auto-trim the pad under the package. 

But you can turn Pad Trimming off in "Tools > Options > SMD Pad Stack Rules > Pad Trimmng. 

50% of Footprint Expert users trim the low-profile body pads and 50% do not trim. It's a user option. 

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