Footprint Expert 2021.18 Released!!

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2021.18 was just released!!

Updates & Bugs Fixed:
CAD Tool Translators:
Fixed an issue with multiple CAD tools. When the Build Library path was too long the program created an alternate folder
Fixed an issue with KiCad not getting Assembly Outlines on Non-Plated holes
Fixed an issue with Saving My Settings causing an Unhandled Exception Error
Options:
Added a new Rounded Rectangle feature for through-hole square pads in V2021.17 that caused regression for all SMD and PTH rounded rectangle pads
Changing the 'Density level (suffix)' Option, the “Courtyard to Body Excess” and “Courtyard to Pad Excess” didn't update
FP Designer:
Added Cole switches to the ManufactureList.txt
Fixed a Silkscreen on Pad bug in V2021.17 that caused regression for all FP Designer footprint silkscreen outlines
Calculators:
The master options value for Paste Mask is for Annular Ring and it was set to oversize instead
QFP w/Thermal Add Fiducials changed the thermal pad pin number
Axial Lead family – the silkscreen did not trim properly when the pads were a close pitch
Chip component family – the body width dimension was missing the leading zero when using the IPC-7351B naming convention
BGA Courtyard was 90 degrees out of rotation when opening a rectangle BGA

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1904	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 2021.18 Released!! Posted: 19 Oct 2021 at 4:09pm
	2021.18 was just released!! Updates & Bugs Fixed: CAD Tool Translators: Fixed an issue with multiple CAD tools. When the Build Library path was too long the program created an alternate folder Fixed an issue with KiCad not getting Assembly Outlines on Non-Plated holes Fixed an issue with Saving My Settings causing an Unhandled Exception Error Options: Added a new Rounded Rectangle feature for through-hole square pads in V2021.17 that caused regression for all SMD and PTH rounded rectangle pads Changing the 'Density level (suffix)' Option, the “Courtyard to Body Excess” and “Courtyard to Pad Excess” didn't update FP Designer: Added Cole switches to the ManufactureList.txt Fixed a Silkscreen on Pad bug in V2021.17 that caused regression for all FP Designer footprint silkscreen outlines Calculators: The master options value for Paste Mask is for Annular Ring and it was set to oversize instead QFP w/Thermal Add Fiducials changed the thermal pad pin number Axial Lead family – the silkscreen did not trim properly when the pads were a close pitch Chip component family – the body width dimension was missing the leading zero when using the IPC-7351B naming convention BGA Courtyard was 90 degrees out of rotation when opening a rectangle BGA
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