Additional Settings for Xpedition Padstack Export

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   Hello,
how can I define additional settings when generating outputs (Padstacks) for Siemens EDA - Xpedition?

Currently when generating Padstack.hkp files to be imported into EDM Librarian the names for PADs/HOLEs are very rudimentary and do not follow the Xpedtion naming scheme nor the IPC recommendation.

When generating an unencrypted ASCII export I've also noticed that the option "AUTO_GENERATED_NAME" is set for Holes which than isn't true.

Therefore now my question: How can I influence the definition of the pad/hole names and the additional settings as marked in the example?

Thanks.
Poldi

Example:
###################################
.FILETYPE PADSTACK_LIBRARY
.VERSION "02.00"
.CREATOR "PCB Libraries FPX Expert"
.DATE "Thursday, August 31, 2023 4:45:42 PM"

.UNITS MM

.PAD "Round 1.28mm"
 ..ROUND
  ...DIAMETER 1.28
 ..OFFSET (0, 0)

.PAD "Thermal 1.635mm"
 ..4_WEB_ROUND_THERMAL_45
  ...DIAMETER 1.635
  ...TIE_LEG_WIDTH 0.307
  ...THERMAL_CLEARANCE 0.1925
 ..OFFSET (0, 0)

.PAD "Round 1.635mm"
 ..ROUND
  ...DIAMETER 1.635
 ..OFFSET (0, 0)

.HOLE "Rnd 0.85"
 ..ROUND
  ...DIAMETER 0.85
 ..POSITIVE_TOLERANCE 0.08
 ..NEGATIVE_TOLERANCE 0.08
 ..HOLE_OPTIONS PLATED DRILLED AUTO_GENERATED_NAME
 ..DEPTH_ASSIGNMENT_METHOD THROUGH_HOLE
 ..DRILL_SYMBOL
  ...ASSIGN_DURING_OUTPUT
   ....SIZE 1.5

.PADSTACK "c128h85"
 ..PADSTACK_TYPE PIN_THROUGH
 ..TECHNOLOGY "(Default)"
  ...TECHNOLOGY_OPTIONS NONE
  ...TOP_PAD "Round 1.28mm"
  ...INTERNAL_PAD "Round 1.28mm"
  ...BOTTOM_PAD "Round 1.28mm"
  ...CLEARANCE_PAD "Round 1.635mm"
  ...THERMAL_PAD "Thermal 1.635mm"
  ...TOP_SOLDERMASK_PAD "Round 1.28mm"
  ...BOTTOM_SOLDERMASK_PAD "Round 1.28mm"
  ...HOLE_NAME "Rnd 0.85"
   ....OFFSET (0, 0)
###################################

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pildo Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 24 Apr 2023 Status: Offline Points: 2	Post Options Post Reply Quote pildo Report Post Thanks(0) Quote Reply Topic: Additional Settings for Xpedition Padstack Export Posted: 31 Aug 2023 at 9:30am
	Hello, how can I define additional settings when generating outputs (Padstacks) for Siemens EDA - Xpedition? Currently when generating Padstack.hkp files to be imported into EDM Librarian the names for PADs/HOLEs are very rudimentary and do not follow the Xpedtion naming scheme nor the IPC recommendation. When generating an unencrypted ASCII export I've also noticed that the option "AUTO_GENERATED_NAME" is set for Holes which than isn't true. Therefore now my question: How can I influence the definition of the pad/hole names and the additional settings as marked in the example? Thanks. Poldi Example: ################################### .FILETYPE PADSTACK_LIBRARY .VERSION "02.00" .CREATOR "PCB Libraries FPX Expert" .DATE "Thursday, August 31, 2023 4:45:42 PM" .UNITS MM .PAD "Round 1.28mm" ..ROUND ...DIAMETER 1.28 ..OFFSET (0, 0) .PAD "Thermal 1.635mm" ..4_WEB_ROUND_THERMAL_45 ...DIAMETER 1.635 ...TIE_LEG_WIDTH 0.307 ...THERMAL_CLEARANCE 0.1925 ..OFFSET (0, 0) .PAD "Round 1.635mm" ..ROUND ...DIAMETER 1.635 ..OFFSET (0, 0) .HOLE "Rnd 0.85" ..ROUND ...DIAMETER 0.85 ..POSITIVE_TOLERANCE 0.08 ..NEGATIVE_TOLERANCE 0.08 ..HOLE_OPTIONS PLATED DRILLED AUTO_GENERATED_NAME ..DEPTH_ASSIGNMENT_METHOD THROUGH_HOLE ..DRILL_SYMBOL ...ASSIGN_DURING_OUTPUT ....SIZE 1.5 .PADSTACK "c128h85" ..PADSTACK_TYPE PIN_THROUGH ..TECHNOLOGY "(Default)" ...TECHNOLOGY_OPTIONS NONE ...TOP_PAD "Round 1.28mm" ...INTERNAL_PAD "Round 1.28mm" ...BOTTOM_PAD "Round 1.28mm" ...CLEARANCE_PAD "Round 1.635mm" ...THERMAL_PAD "Thermal 1.635mm" ...TOP_SOLDERMASK_PAD "Round 1.28mm" ...BOTTOM_SOLDERMASK_PAD "Round 1.28mm" ...HOLE_NAME "Rnd 0.85" ....OFFSET (0, 0) ###################################