PCB Libraries Forum : Paste Mask Question https://www.PCBLibraries.com/forum/ Wed, 15 Apr 2026 14:52:06 +0000 Thu, 24 May 2018 06:19:39 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 360 https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=2342 <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Paste Mask Question : If you use Rectangle Pad Shape,...]]> https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9637.html#9637 Author: Tom H
Subject: 2342
Posted: 24 May 2018 at 6:19am

If you use Rectangle Pad Shape, the Paste Mask aperture will be Rounded Rectangle, so you might as well use Rounded Rectangle for the pad shape too.
]]> Thu, 24 May 2018 06:19:39 +0000 https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9637.html#9637 <![CDATA[Paste Mask Question : Thank you! That was fast. ]]> https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9636.html#9636 Author: vavouris
Subject: 2342
Posted: 24 May 2018 at 6:15am

Thank you! That was fast.]]> Thu, 24 May 2018 06:15:05 +0000 https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9636.html#9636 <![CDATA[Paste Mask Question : For Standard SMD pads the Paste...]]> https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9635.html#9635 Author: Tom H
Subject: 2342
Posted: 24 May 2018 at 6:08am

For Standard SMD pads the Paste Mask aperture size is 1:1 scale.

For Thermal Tab pads the Paste Mask Reduction is between 40 - 60%.

]]> Thu, 24 May 2018 06:08:38 +0000 https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9635.html#9635 <![CDATA[Paste Mask Question : Hi,I&#039;d like to ask what is...]]> https://www.PCBLibraries.com/forum/paste-mask-question_topic2342_post9634.html#9634 Author: vavouris
Subject: 2342
Posted: 24 May 2018 at 5:50am

Hi,

I'd like to ask what is the general guideline for paste stencils. 

Should the stencil be same size as the pad, smaller or greater? 

I know that in BGA packages we want very few solder paste on the pad. And on other packages, I was creating a paste mask figure 70% of the pad. 

I am a bit confused now, and I don't know if should continue to do that or leave it 1:1 and let the assembly plant deal with it.

Thanks,
Theocharis
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