Version 2014.07 was just released!!

NEW:

• FP Designer: New custom Pad Stack Manager
• Chamfer or radius any SMD pad corner
• Create custom through-hole pad stacks for outer and inner layers, plane thermal relief and anti-pad
• Offset slotted holes
• Assign pad stacks to pin numbers
• New FPXC to CAD Translator:
• This feature was removed and FPXC was converted to FPX. Now all Unique footprints are stored in our new V2015 FPX format.
• New “Sample Data – V2015.fpx” file for unique packages now comes with installation
• Altium:
• PADS ASCII files for Altium now produces “Plated” surface mount pads to avoid DRC errors

FIXED / ENHANCED:

• Calculator:
• TO DPAK issue when saving to FPX and retrieving from Library Editor removed a pin
• TO220 Horizontal issue when saving to FPX and retrieving from Library produced the Vertical dimensional picture
• Rename pins when Mirror was turned on threw an unhandled exception error
• User Preferences:
• Ability to turn off Local Fiducials
• In the new Chip micro-miniature parts, the Courtyard Excess was not retaining values that were changed
• Library Editor:
• The auto-generation of Physical Description and Manufacturer Name was causing problems when the cells were edited
• 3D STEP:
• The Chip Family Types Capacitor, Fuse, Thermistor, and Varistor  all use the same base 3D model. They differ by default body color(Orange, Green, Blue, and Black.. respectively). That model has also been updated to a nicer form.
• The Chip Family Type Capacitor, Non-Polarized has been renamed to Capacitor
• The Chip Family Type Capacitor, Polarized now has the 3D model of Chip, Wire Rectangular. Chip, Wire Rectangular has been deprecated. Use Chip, Polarized for any Chip, Wire Rectangular applications.
• CAD Tool Interfaces:
• Eagle:
• The paste mask flag as it concerns through-hole parts
• Through-hole pad has a drill size bigger than the pad, it’s now turned into a Hole. This should make it easier to see.
• P-CAD
• Problem with the default Pad Stack. Files should import as usual again
• FP Designer:
• Was not producing a “Body Outline” for IDF 3D extrusion
• PADS to CAD Translator:
• Problem in the detection of Squares and Rectangles