Version 2013.11 was just released!!

• The following additional component families now get auto-3D STEP models
•  Axial (All Types)
•  DIP
•  DIP Socket
•  Oscillator
•  PGA
•  Radial (All Types)
•  SIP
•  TO Cylindrical
• SOL Family added
• ‘Inward L’ terminal type added
• ‘Outward Flat Ribbon L’ terminal type changed to ‘Outward L’
• Link to Help changed from on-line to local CHM file, allows faster search and indexing
• Transistor family added to 3 pin DFN
• Added auto-complete to FP Designer manufacturer pull down
• Duplicate pin numbers allowed in FP Designer

 FIXED:

• 3D STEP models for TO and DSC now generating properly
• Fixed dimension bug in LCC (D,E)
• Stencil now appears as expected in small thermal tabs
• Assembly graphics appears as expected in tabs
• Grid array/header column height adjusted (appeared truncated on some displays)
• AEC Physical Description changed to “Capacitor, Aluminum Electrolytic” to be consistent with other capacitors
• 3-D GUI text changed to 3D, to be consistent
• 3D TH checkboxes updated per the new additions for automatic 3D STEP
  2 pin DFN silkscreen corrected
• SIP terminal description corrected
• Removed 2.0 mm restriction on SO body size
• Tabs on Assy pull-down bug fixed
• Footprint Designer pin import origin offset adjusted
• Manufacturer prefix now loads in FP Designer as expected
• Footprint Designer "Manufacturer List" almost doubled in size
• Default "Grid Array" family preferences now save as expected